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RF Ceramic Chip Inductors

Description

High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin plated nickel barrier terminations and tape and reel packaging which makes them ideal for small size/high volume wireless applications.

Applications:

  • CELL/PCS Modules
  • Wireless LAN
  • Broadband Components
  • RFID
  • RF transceivers
  • RoHS Compliant (Standard, “V” Code)
  • Sn/Pb Terminations Optional (“T” Code)
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