XL-25 Ceramic Heat Spreader
- Open-porous structure increases air contact area
- Best for limited space
- High breakdown voltage/ high resistance
- Good thermal conduction/ Low thermal expansion coefficient
- EMI reduction
- High reliability
- Description
Description
Suitable for limited installation space and can adapt to severe changes in the environment
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.
| Standard Sizes (mm) | ||
| 1. 10x10x2.0 (Flat) | 2. 15x15x2.5 (Flat) | 3. 15x15x5.0 (fin) |
| 4. 20x15x2.0 (Flat) | 5. 20x20x2.0 (Flat) | 6. 20x20x2.5 (Flat) |
| 7. 22x22x2.5 (Flat) | 8. 30x30x2.0 (Flat) | 9. 30x30x2.5 (Flat) |
| 10. 30x30x5.0 (fin) | 11. 35x35x10.0 (fin) | 12. 40x40x2.5 (Flat) |
| 13. 40x40x3.0 (Embossed) | 14. 40x40x5.0 (fin) | 15. 40x40x10.0 (fin) |
| 16. 50x50x3.0 (Embossed) | 17. 50x50x5.0 (fin) | 18. 50x50x10.0 (fin) |
| Properties | XL-25 | Unit | Tolerance | Test Method |
| Thermal Conductivity | 10 | W / mK | ±0.67 | – |
| Color | Gray/ Green | – | – | Visual |
| Insulation Strength | 500 | Voltage | – | ASTM D149 |
| Bulk Density | 1.89 | g / cm3 | ±0.18 | CNS 619 |
| Flexural Strength | 47.5 | Kgf / cm2 | – | CNS 12701 |
| Porosity | 25 | % | – | CNS 619 |
| Water Absorption | 16 | % | – | CNS 619 |
| Working Temperature | <500 | °C | – | – |
| Linear Thermal Expansion Coefficient | 4.13 | 10-6 | – | RT~300°C |
| Main Composition | Sic/ Al2O3/ SiO2 | – | – | – |
| Hardness | 5~6 | Moh’s | ±0.6 | DIN En101-1992 |
| ●Compliance with REACH ●Compliance with RoHS | ||||
| ●Need samples? | ||||
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