New
123A-58E01
M.2 connector, also known as the Next Generation Form Factor (NGFF) is originally designed for the ultra-thin products. Its compact size could save over 20% of PCB design space compare with mini PCIe connector. M.2 connector applies to high-speed data transmission that supports PCI Express 3.0, SATA 3.0 and USB 3.0.
- Description
Description
Description
MAIN FEATURES
Miniature in Size:
Compared with Mini PCI Express, M.2 saves 25% in heights and 55%
in which sufficiently save the space of the PCB layout.
There are two key dimension need to check.
in which sufficiently save the space of the PCB layout.
There are two key dimension need to check.
- Dim. A：The heights are between min- 2.1mm to max- 8.5mm.
- Dim. B：For double-sided modules, this height is also important to keep in mind.
Application:
- SSD Module
- Wi-Fi Module
- NAS
- Tablets
- Gaming
- Servers
SPECIFICATION
| Current Rating | 0.5A per pin |
|---|---|
| Voltage Rating | 50VAC |
| Contact Resistance | 55mΩ, Δ20Ω Max. |
| Insulation Resistance | 500MΩ |
| Dielectric Withstanding Voltage | 300VAC |
| Durability | 60 Cycle |
|---|---|
| Mating Force | 20N max. |
| Un-mating Force | 20N max. |
| Operating temperature range | -40℃~+85℃ |
|---|---|
| Storage temperature range | -40℃~+85℃ |
| Recommended IR Reflow(Wave Soldering) Temperature | 260℃ |
|---|
