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TP 300 Series thermal pad

TP 300 Series thermal pad

TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.


Product features:Soft and highly compliant, Naturally tacky, easing application
Typical applications:Industrial: LEDs, Power Supplies and Conversion
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Addcom Solution Pte Ltd