TP 120 Series thermal pad
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
Product features：Good thermal conductivity, Extremely soft and cost effective
Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
