Wave Series BGA Heat Sink
The Wakefield-Vette Wave Series Heat Sink Series are a superior choice for cooling BGA applications in which limited height/footprint while achieving maximum surface area. The Wave Series Heat Sinks include a unique clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The clipping mechanism allows for easy installation in high production assembly.
- Description
Description
Description
Mechanical Dimensions (mm) |
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| Part # | Attachment Method | Length | Width | Fin Width | Height | Surface Area (sq mm) | Height Off Base (Fin Height) | Thermal Res. @200 LFM |
| WAVE-26-12 | Spring-Anchor | 26 | 26 | 52.9 | 12 | 8305.2 | 10 | 5.21 |
| WAVE-29-127 | Spring-Anchor | 29 | 29 | 61.4 | 12.7 | 11810.5 | 10.7 | 4.08 |
| WAVE-32-12 | Spring-Anchor | 32 | 32 | 50.2 | 12 | 10957.5 | 10 | 4.64 |
| WAVE-34-21 | Spring-Anchor | 34 | 34 | 70 | 21 | 21268.4 | 19 | 2.19 |
| WAVE-35-12 | Spring-Anchor | 35 | 35 | 62 | 12 | 15180.8 | 10 | 3.83 |
| WAVE-35-125 | Spring-Anchor | 35 | 35 | 63.3 | 12.5 | 15792.6 | 10.5 | 3.63 |
| WAVE-35-15 | Spring-Anchor | 35 | 35 | 58.1 | 15 | 15612.7 | 13 | 3.15 |
| WAVE-35-21 | Spring-Anchor | 35 | 35 | 74.6 | 21 | 21721.8 | 19 | 2.11 |
| WAVE-366-175 | Spring-Anchor | 36.6 | 36.6 | 63.6 | 17.5 | 18637.8 | 15.5 | 2.55 |
| WAVE-40-12 | Spring-Anchor | 40 | 40 | 66.9 | 12 | 17689.4 | 10 | 3.36 |
| WAVE-40-125 | Spring-Anchor | 40 | 40 | 68.3 | 12.5 | 18410.1 | 10.5 | 3.16 |
| WAVE-425-117 | Spring-Anchor | 42.5 | 42.5 | 67.4 | 11.7 | 21668.3 | 9.3 | 3.4 |
| WAVE-45-12 | Spring-Anchor | 45 | 45 | 72 | 12 | 22303.7 | 10 | 2.96 |
Features & Benefits
- Approximately 12% better thermal performance than traditional footprint heat sinks
- Height- A low profile design allows for more surface area in a height restricted application
- Clipping mechanism included with heat sink
- Surface Area- Fin array allows for more surface area for forced convection
- Easily customization
- Easily compatible with major BGA device manufacturers components such as: Broadcomm, Motorola, Freescale, TI, Intel, etc.
Material Specifications
- Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish.
- Spring Clip: 304 Stainless Steel, 1.2mm [0.47″] DIA
- RoHS Compliant
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